Effects of Additives on Polarization Curves in Electroless Copper Plating Bath Containing EDTA as Complexing Agent
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چکیده
منابع مشابه
Electroless Nickel Plating: Bath Control
In this paper, bath control is proposed for the electroless nickel plating through holes board process. The main parameters of the product (board) – thickness of the plating film and phosphorous content – are stabilized at constant levels using optimal tracking control. The set point for control is calculated from the model in dependence on the current state of the process. The pH-index and nic...
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New copper plating bath chemisties are being developed to meet the emerging need of plating copper into submicron features on semiconductor wafers. These chemistries are designed to provide a fast, efficient, fill for even the most challenging wafer terrain. It has been found that maintaining the concentration of the additives in these plating baths at certain levels is critical to the performa...
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ژورنال
عنوان ژورنال: Journal of the Metal Finishing Society of Japan
سال: 1972
ISSN: 1884-3395,0026-0614
DOI: 10.4139/sfj1950.23.465